Worldwide IC Packaging And Testing Market In Recap And Outlook

Recap and Outlook of Worldwide IC Packaging and Testing Industry in 2016 is a new research report added at

The worldwide IC packaging and testing industry, worldwide and Taiwanese companies alike, suffered weak growth momentum in 2015 due to declines in the global PC market and a slowdown in mobile device sales. Despite the new opportunities contributed by non-3C segments such as automobile and IoT (Internet of Things), growth of these segments has remained limited as they are still in the early stages of development.

Complete Recap and Outlook of Worldwide IC Packaging and Testing Industry in 2016 spreads across 14 pages, 25 companies and supported with 6 data figures is available at

Therefore, 3C products will continue to be a key driving force to fuel growth. In response to changes in the industry, foreign and Taiwanese IC packaging and testing vendors have introduced many new strategies and deployments. This report reviews the business performance of the worldwide IC packaging and testing industry in 2015 and analyzes its development in 2016.

List of Topics: Overview of the worldwide IC packaging and testing industry, including OSAT industry's shipment value and share by country from 2014 to 2017. Summary of the development of key players, including Amkor and UTAC, leading Chinese vendors Jiangsu Changjiang Electronics Technology, Tianshui Huatian Technology, and Nantong Fujitsu Microelectronics, as well as leading Taiwanese vendors ASE, SPIL, and PTI; also included are vendors' strategic alliance with upstream wafer foundries in China

List of Companies are AMD, Amkor, ASE, ASE Embedded Electronics Incorporated, FCI, Foxconn, Infineon, Inotera Memories, J-Devices, Jiangsu Changjiang Electronics, Micron, Nantong Fujitsu Microelectronics, ProMOS Technologies, PTI, Shanghai Huahong Grace, Shanghai Huali Microelectronics, SJsemi, SMIC, SPIL, STATS ChipPAC, TDK, Tianshui Huatian Technology, USI, UTAC and XM.

Order a Copy of Report at

Table of Contents
1. Worldwide IC Packaging and Testing Industry Shipment Value
1.1 OSAT Industry Shipment Value Declines in 2015 on Weak Market Demand
1.2 Taiwan Boasts Largest Shipment Value Share in 2015, Followed by China

2. Leading International Vendors' Development
2.1 Amkor Acquires J-Device for Automotive IC Market; UTAC Focuses on Product Diversification
2.2 China Eyes on High-end Technology and Turn-key Solutions

3. Leading Taiwanese Vendors' Development
3.1 ASE Develops Diversified Technologies in Multiple Industries
3.2 SPIL Develops SiP with Foxconn; PTI Enhances Deployment in China with Micron

4. Conclusion
4.1 China's Horizontal Integration Poses Threats to Taiwanese Vendors
4.2 Taiwan can Maintain Competitiveness via Horizontal and Vertical Integration

Glossary of Terms
List of Companies

List of Figures
Figure 1: Worldwide OSAT Industry Shipment Value and Growth Rates, 2014 - 2017
Figure 2: OSAT Industry Shipment Value Share by Country, 2014 - 2017
Figure 3:Leading International IC Packaging and Testing Vendors' Milestones
Figure 4: Leading Chinese Packaging and Testing Vendors' Acquisition of Advanced Technologies and Provisioning of Turn-key Solutions
Figure 5: ASE's Technology Development and Industrial Deployment
Figure 6: Recent Developments of SPIL and PTI

Make an Inquire on the Report at

About Us: is your single source for all market research needs. Our database includes 500,000+ market research reports from over 100+ leading global publishers & in-depth market research studies of over 5000 micro markets. With comprehensive information about the publishers and the industries for which they publish market research reports, help in purchase decision by mapping the information needs with the huge collection of reports.

Contact Info:
Name: Ritesh Tiwari
Email: Send Email
Organization: RnRMarketResearch
Phone: + 1 888 391 5441

Release ID: 138094