Taiwanese IC Packaging and Testing Market Product, Production, Revenue, Price, & Industry Analysis 2Q 2017

Dallas United States, June 20, 2017 /MarketersMEDIA/ -- The report finds that Taiwanese IC packaging and testing industry still manged to grow year-on-year but declined sequentially in the first quarter of 2017, the traditionally weak season. Shipment value of the industry in the first quarter stood at approximately USD 3.25 billion. Affected by the deferred demand in the second quarter in anticipation of the new iPhone rollout, it is the industry is forecast to start to pick up momentum in the third quarter of 2017.

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List of Topics:
This research report presents shipment value forecast and recent quarter review of the Taiwanese IC packaging and testing industry.
Companies surveyed in this research are contract manufacturers focusing on IC packaging and testing for IC suppliers around the world.
The content of this report is based on primary data obtained from interviews, and publicly available information.

Companies covered:
Ardentec, ASE, Chipbond, ChipMOS, FATC, KYEC, OSE, PTI, Sigurd, SPIL, Walton

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TOC:

Taiwanese IC Packaging and Testing Industry Shipment Value, 1Q 2015 - 3Q 2017
Taiwanese IC Packaging and Testing Industry Shipment Value by Service Type, 4Q 2014 - 3Q 2017
Taiwanese IC Packaging Industry Shipment Value , 1Q 2015 - 3Q 2017
Taiwanese IC Testing Industry Shipment Value , 1Q 2015 - 3Q 2017
Taiwanese IC Packaging Industry's Shipment Value Rankings, 1Q 2015 - 1Q 2017
Taiwanese IC Packaging Industry Shipment Value by Vendors' Tier, 1Q 2015 - 1Q 2017
Taiwanese IC Testing Industry's Shipment Value Rankings, 1Q 2015 - 1Q 2017
Taiwanese IC Testing Industry Shipment Value by Vendors' Tier, 1Q 2015 - 1Q 2017
Taiwanese IC Packaging Industry Shipment Value by Shipment Destination, 1Q 2015 - 1Q 2017
Taiwanese IC Packaging Industry Shipment Value Share by Shipment Destination, 4Q 2014 - 1Q 2017
Taiwanese IC Testing Industry Shipment Value by Shipment Destination, 4Q 2014 - 1Q 2017
Taiwanese IC Testing Industry Shipment Value Share by Shipment Destination, 4Q 2014 - 1Q 2017
Exchange Rate, 4Q 2014 - 1Q 2017
Research Scope & Definitions

Contact Info:
Name: Hector Costello 
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Organization: Orbis Research
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Phone: +912064101019
Website: http://www.orbisresearch.com/reports/index/taiwanese-ic-packaging-and-testing-industry-2q-2017

Release ID: 209559