Optical Interconnect Market Soaring at 18+% CAGR to Exhibit $US13.03 Bn by 2022

Optical interconnect market is driven by increasing requirement for bandwidth and low power consumption while chip-level market to gain maximum traction between 2016 and 2022 dominated by APAC with highest rate during the forecast period.

The optical interconnect market size, in terms of value, is expected to grow from USD 3.66 billion in 2015 to USD 13.03 billion by 2022, at a CAGR of 18.13% between 2016 and 2022. Optical network component makers have witnessed an increased shipment of products for different applications such as data centers, high-performance computing, and telecommunication networks. It is expected that increasing Internet connectivity and rising need for high-speed data center networks would give impetus to this growth momentum. The major obstacle for the growth of the optical interconnects market is the high initial cost of installing and implementing optical interconnects for data communication application areas such as data centers and comparatively slow commercialization of various optical interconnection-related technologies.

Complete report on global optical interconnect market spread across 160 pages, profiling 13 companies and supported with 68 tables and 76 figures is now available at http://www.reportsnreports.com/reports/718281-optical-interconnect-market-by-interconnect-level-chip-level-rack-board-to-board-metro-long-haul-fiber-mode-single-mode-multi-mode-product-category-application-and-geography-global-forecast-to-2022.html .

The market for chip-level interconnects is estimated to grow at the highest rate during the forecast period. The growing adoption of parallel computing and emergence of 3D chips have also led to a sort of data traffic blockage at on-chip and chip-to-chip-level interconnections, which is further rising the demand for chip-level optical interconnects. The multicore processors have made it imperative for extremely fast CPU-to-CPU and CPU-to-memory devices data transmission, which is further pushing the adoption of high-speed optical, interconnects at the chip level.

APAC region is expected to grow at the highest CAGR for optical interconnect market. The rapidly increasing consumer Internet penetrations as well as a very high growth of Internet-based businesses combined with increasing spend by government and industries on up gradation of data communication and telecommunication networks are leading drivers.

Companies that provide a wide range of products across different interconnect levels and applications are expected to dominate the market. The major focus for the optical interconnects market has to be on data communication applications which include both data centers and high-performance computing. Adoption of advanced technologies for manufacturing optical components is also one of the crucial factors for penetration of optical interconnects in the data communication application segment.

The key players in the optical interconnect market profiled in the report are as follows:

• Finisar Corporation (U.S.)
• Molex (U.S.)
• Mellanox (U.S.)
• Oclaro Inc (U.S.)
• Acacia Communications (U.S.)
• Juniper Networks (U.S.)
• Infinera (U.S.)
• Broadcom Ltd. (U.S.)
• Sumitomo Electric Industries Ltd. (Japan)
• TE Connectivity (Switzerland)
• Amphenol FCI (U.S.)
• Fujitsu Ltd. (Japan)
• Lumentum Holdings (U.S.)

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In the process of determining and verifying the market size for several segments and sub segments gathered through secondary research, extensive primary interviews have been conducted with key people. The break-up of profile of primary participants is given below:

• By Company Type: Tier 1 – 20%, Tier 2 – 45%, and Tier 3 – 35%
• By Designation: C-Level Executives – 35%, Directors – 25%, and Others – 40%
• By Region: North America – 45%, Europe – 20%, APAC – 30%, and RoW – 5%

Research Coverage

The geographic segmentation in the report covers the four major regions of the world, namely, North America, Europe, APAC, and RoW. The product category segment covers the market size for cable assemblies, connectors, optical transceivers, optical engines, PIC-based interconnects, silicon photonics, free space optics, fiber- and waveguides-based interconnects. The application segment covers data communication which includes data centers and high-performance computing, and telecommunication. The interconnect level market segmentation includes chip & board level which includes chip-to-chip, chip-to-board, and on-chip interconnects, board-to-board, and rack level which includes board-to-board, board-to-rack, and rack-to-rack interconnects, and long haul and metro.

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