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The system-in-package is the number of integrated circuits that are enclosed in a single chip carrier called package. They are primarily used in electronic devices like digital music player, tablets, laptops, smartphones, and others. Higher functionality at low production costs and the increasing demand for compact electronics products and mechanical devices have fueled the development of System-in-Package (SiP) solutions. SiP has emerged as a replacement to the System-on-Chip (SoC) due to various characteristics such as low research and development cost, flexibility, low product cost, and low NRE (non recurring engineering) cost. The technology is widely used in memory stacks or logic devices in the mobile applications.
The packaging has developed the safety systems in the transportation and the automotive industry, which will further drive the SiP market. For instance, Atmel Corporation has launched the local Interconnect Network solution (LIN) for operating the devices within a vehicle. ICs in the SiP are primarily interrelated with each other to develop a single integrated unit. This technology has penetrated the communications, consumer and medical electronics, computing, automotive, networking, and mobile and is growing rapidly across the globe.
The system-in-package helps in combining multiple advanced packaging technologies for creating customized solutions for each end application. The key factors propelling the market growth include development of advanced and miniaturized electronic devices and the packaging cost associated with ICs based on different sizes. However, the less availability of skills and resources are expected to hinder the SiP market growth. Additionally, the increasing demand for high performance electronic devices is further creating growth opportunities for the SiP market.
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FOCos: In Feb 2018, Advanced Semiconductor Engineering, (ASE) and Cadence Design Systems have jointly developed a System-in-Package (SiP) EDA solution for addressing the issues of designing and verifying Fan-Out Chip-on-substrate (FOCos) multi-die packages. The solution consists of the SiP-id and by integration of the SiP-id methodology, designers can reduce design iterations and can enhance the throughput, as compared to the existing packaging EDA tools. Thus, it reduces the time needed to design and verify ultra-complex SiP packages.
European: In Oct 2018, ON Semiconductor has achieved the first CE Certified RF System-in-Package with Sigfox Connectivity. ON Semiconductor has received the CE certification for its AX-SIP-SFEU System in
Package (SiP) solution. This certification implies that the device conforms to health, safety, and environmental protection standards for products sold within the European Economic Area. This will increase the European market across the globe.
Microchip: In Nov 2018, Microchip has launched a new System-in-Package (SiP) series called SAM R34/35 that includes an ultra-low-power 32-bit microcontroller (MCU), sub-GHz RF LoRa transceiver, and software stack. The new device is being powered by the SAM L21 Arm Cortex-M0+, which is based on the MCU to provide low sleep modes, i.e, 790 nA. This significantly reduces power consumption and increases the battery life in end applications. It is primarily used for a wide gamut of long-range, low-power IoT applications and it requires small form factor designs and long battery life.
Key Questions Answered in the Report:
• What is the market value of the overall market and segments?
• What are the key segments and sub-segments in the market?
• Which is the largest sub-segment in each segment in the scope of the study?
• What are the key drivers, restraints, opportunities, and challenges in the market and how are they expected to impact the market?
• What are the attractive segments and geographies to invest in?
• What is the market value and volume at the regional and the country level?
• Who are the key market players and their key competitors?
• Who are the key market players at different stages of the value chain?
• What are the strategies for growth adopted by the key players in the market?
• How does a particular company rank against its competitors with respect to revenue, profit comparison, operational efficiency, cost competitiveness, and market capitalization?
• How financially strong are the key players in the market (on the basis of revenue and profit margin, market capitalization, expenditure analysis, investment analysis)?
• What are the recent trends in the market? (M&A, partnerships, new product developments, expansions)
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Related Reports on system-in-package Market: Global System-in-Package Market Summary Report Global System-in-Package Market Segmentation Report Global System-in-Package Market Regional Report Global System-in-Package Market Competitive Intelligence & Company Profiles Report Global System-in-Package Market Statbook
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