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Global Computer on Module Market 2018A computer on module or a system on module is a small form-factor, ready-to-use computing solution. It consists of application agnostic hardware along with software to form an embedded system.
Technavio’s analysts forecast the global computer on module market to grow at a CAGR of 6.78% during the period 2018-2022.
Covered in Computer on Module Market report
The report covers the present scenario and the growth prospects of the global computer on module market for 2018-2022. To calculate the market size, the report considers the revenue generated from the use of various types of computer on module.
The Computer on Module market is divided into the following segments based on geography:
Americas
APAC
EMEA
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Our report, Global Computer on Module Market 2018-2022, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.
Key vendors for Computer on Module are
Advantech
Avnet
congatec
Kontron S&T
Radisys
Market driver
Increasing need for ruggedized robots in defense applications
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Computer on Module Market challenge
Trade-off between use of different computer architectures
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Market trend
Growing investments in autonomous cars
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Key questions answered in this report
What will the market size be in 2022 and what will the growth rate be?
What are the key Computer on Module market trends?
What is driving this market?
What are the challenges to market growth?
Who are the key vendors in this market space?
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Companies Mentioned in Computer on Module market are:
Advantech, Avnet, congatec, Kontron S&T, Radisys
PART 01: EXECUTIVE SUMMARY
PART 02: SCOPE OF THE REPORT
PART 03: RESEARCH METHODOLOGY
PART 04: MARKET LANDSCAPE
Market ecosystem
Market characteristics
Computer on Module Market segmentation analysis
PART 05: MARKET SIZING
Market definition
Market sizing 2017
Computer on Module Market size and forecast 2017-2022
PART 06: FIVE FORCES ANALYSIS
Bargaining power of buyers
Bargaining power of suppliers
Threat of new entrants
Threat of substitutes
Threat of rivalry
Market condition
PART 07: MARKET SEGMENTATION BY APPLICATION
Segmentation by application
Comparison by application
Industrial automation – Market size and forecast 2017-2022
Medical – Market size and forecast 2017-2022
Transportation – Market size and forecast 2017-2022
Entertainment – Market size and forecast 2017-2022
Others – Market size and forecast 2017-2022
Computer on Module Market opportunity by application
PART 08: MARKET SEGMENTATION BY STANDARD
Segmentation by standard
Comparison by standard
COM Express – Market size and forecast 2017-2022
SMARC – Market size and forecast 2017-2022
Qseven – Market size and forecast 2017-2022
ETX – Market size and forecast 2017-2022
Others – Market size and forecast 2017-2022
Computer on Module Market opportunity by standard
PART 09: MARKET SEGMENTATION BY CPU ARCHITECTURE
Segmentation by CPU architecture
Comparison by CPU architecture
ARM – Market size and forecast 2017-2022
x86 – Market size and forecast 2017-2022
Others – Market size and forecast 2017-2022
Market opportunity by CPU architecture
PART 10: CUSTOMER LANDSCAPE
PART 11: REGIONAL LANDSCAPE
Geographical segmentation
Regional comparison
EMEA – Market size and forecast 2017-2022
Americas – Market size and forecast 2017-2022
APAC – Market size and forecast 2017-2022
Key leading countries
Market opportunity
PART 12: DECISION FRAMEWORK
PART 13: DRIVERS AND CHALLENGES
Market drivers
Computer on Module Market challenges
PART 14: MARKET TRENDS
Increasing use of drones across many applications
Interest toward improving automotive platforms
Growing investments in autonomous cars
PART 15: VENDOR LANDSCAPE
Overview
Landscape disruption
Competitive scenario
PART 16: VENDOR ANALYSIS
Vendors covered
Vendor classification
Market positioning of vendors
Advantech
Avnet
congatec
Kontron S&T
Radisys
PART 17: APPENDIX
Contact Info:
Name: Hector Costello
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Organization: Orbis Research
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Release ID: 368193