St. Augustine, FL – April 24, 2019 – Carlisle Interconnect Technologies (CarlisleIT), a division of Carlisle Companies (CSL), today announced it has received a 2019 DesignCon Best Paper Award in the Power & RF Design category. The awards program honors CarlisleIT for its outstanding contribution to the diverse educational goals of DesignCon. The Best Paper Awards also serve to acknowledge the authors who receive them as leading practitioners in semiconductor and electronic design.
“Carlisle Interconnect Technologies is excited and proud to have won such a prestigious award,” said Jesse Correia, Business Unit General Manager. “It’s great to see Raul (Stavoli), Davi (Correia) and Emad (Soubh) get the recognition they deserve for the quality of the paper and the engineering they perform.”
The paper, “Demystifying Edge Launch Connectors,” was presented as part of the company’s show theme of “Recalibrating the Standard for Test & Measurement” and focused on overcoming challenges using RF edge launch connectors in commercial applications.
“The notable achievements by this year’s Best Paper Award recipients reinforce the exciting innovation currently taking place in the semiconductor and electronic engineering industries,” said Naomi Price, conference content director, UBM. “DesignCon is proud to honor the outstanding contributions of the participating authors and their organizations and hopes that their achievements will inspire thought leaders in the industry for years to come.”
Recipients of DesignCon’s Paper Award are selected through a two-prong process. The first step is a review of the full-length papers accepted by the members of the DesignCon Technical Program Committee who then rank and determine the finalists for each award category based on quality, relevance, impact, originality, and lack of commercial content. Winners are then chosen from the finalists based on the quality of their presentations at the conference as rated by the attendees.
For more information on DesignCon and the awards program, please visit: DesignCon.com.
About Carlisle Interconnect Technologies
Carlisle Interconnect Technologies is one of the world’s leading designers and manufacturers of high-performance wire and cable, including optical fiber. Since 1940, we have grown our product portfolio to include specialty and filtered connectors, contacts, cable assemblies, complex harnesses, racks, trays and installation kits. In addition to our vast product breadth, we provide our customers a higher level of support by offering engineering and certification services for the commercial aerospace, military and defense electronics, industrial, test & measurement, and medical industries. For more information visit www.CarlisleIT.com.
DesignCon is the world’s premier conference for chip, board and systems design engineers in the high-speed communications and semiconductor communities. DesignCon, created by engineers for engineers, takes place annually in Silicon Valley and remains the largest gathering of chip, board and systems designers in the country. This three-day technical conference and two-day expo combines technical paper sessions, tutorials, industry panels, product demos and exhibits from the industry’s leading experts and solutions providers. More information is available at: www.designcon.com. DesignCon is organized by UBM, which in June 2018 combined with Informa PLC to become a leading B2B information services group and the largest B2B Events organizer in the world. To learn more and for the latest news and information, visit www.ubm.com and www.informa.com.
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